| Product Name | NTC Sensor Module |
| Product series | VTD4-PT100 |
| Product model | VTD4PT0A0500LY0011 |
Product Categories
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Product Drawing
Electrical Characteristic
| Item | Symbol | Test Conditions | Min. | Nor. | Max. | Unit |
|---|---|---|---|---|---|---|
| Resistance At 0℃ | R0 | Ta=0℃ PT≦0.1mW | / | 100.00 | / | Ω |
| Temperature coefficient | TC | / | / | 3850.00 | / | ppm/K |
| Hi-Pot Test | / | AC1200V 3Sec | / | / | 2.0 | m A |
| Insulation test | / | DC500V 1Sec | 100 | / | / | MΩ |
Maximum use grade
| Item | Specification | Unit |
|---|---|---|
| Operation Temperature Range | -30 ～ +200 | ℃ |
| NTC Working Temp.Range | -7 ～ +500 | ℃ |
Mechanical Tests
| Item | Pass Criteria | Test Conditions |
|---|---|---|
| Pull test | Not loose, not deformed | Fasten body with a Load Applied to each lead 1.0 kg for 1min |
| Drop Test | No visible damage | After 5 time natural fall to a maple board from 1M high |
Install and use
1.Use this product within the specified temperature range.
2.Higher temperature may cause deterioration of the characteristics or the material quality of this product.
3.Do not melt the solder in resin head, when you solder this product. If you melt the solder in resin head,it has possibility that the break of wire, short and insulation damage.
4.Do not touch the resin head directly by solder iron. It may cause the melt of solder in resin head.
5.At least away from resin head 10mm above when lead dividing.
6.In case you cut the lead wire of this product less than 10mm from resin head,the heat of melted solder at lead wire edge is propagated easily to the resin head along the lead wire.
7.Radius of lead bending should be more than 1mm when lead bending.Holding element by side lead wire is recommended when lead wire is bent or cut.
8.Do not apply an excessive force to the lead. Otherwise, it may cause junction between lead and element to break or crack.
9.The ceramic element of this product is fragile, and care must be taken not to load an excessive press-force or not to give a shock at handling. Such forces may cause cracking or chipping.
10.If you mold by resin this product, please evaluate the quality of this product before you use it.
Storage Conditions
1.Ambicnt Temperature: -10℃～+40℃
2.Relative Humidity: ≦75%RH
3.Keep away from corrosive atmosphere and sunlight
4.Period of Storage: 1 year
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