Part Number Code
No.
Item
Digit
Specification
(1)
Product Type
TSM
Thinking NTC thermistor TSM type
(2)
Size (EIA)
1
0603
(3)
Type Series&Definition of B Value
C
Automotive Series ; B25/85
(4)
Zero Power Resistance at 25℃ (R25 )
103
10 x 103 Ω = 10 KΩ
(5)
Tolerance of R25
F
± 1%
(6)
B Value
395
3950K
(7)
Tolerance of B Value
1
± 1%
(8)
Packaging
R
Reel
Structure and Dimensions
L1
W
H max.
L2 and L3
1.60±0.15
0.80±0.15
0.95
0.40±0.15
Electrical Characteristics
Soldering Recommendation
IR-Reflow Soldering Profile
Recommended Reworking Conditions with Soldering Iron
Item
Conditions
Temperature of Soldering Iron-tip
360℃ (max.)
Soldering Time
3 sec (max.)
Diameter of Soldering Iron-tip
∮ 3mm (max.)
Caution:Not to touch the component surface with soldering iron directly to prevent component damage.
Max. Power Dissipation Derating Curve
For example：
Ambient temperature(Ta)＝55℃
Maximum operating temperature(Tu)＝150℃
PTa =(Tu-Ta)/(Tu-25)×Pmax＝76% Pmax
Recommended Soldering Pad Dimensions
Environmental Test Summary
Test#
Description
Reference
Test Conditions
Lots Tested
Qty Tested
Number Failed
3
High Temperature Exposure(Storage)
MIL-STD-202 Method 108
1000 hrs. at 150°C Unpowered.
1
1*77
0
4
Temperature Cycling
JESD22 Method JA-104
1000 Cycles (-50°C to +150°C)
1
1*77
0
7
Biased Humidity
MIL-STD-202 Method 103
1000 hours 85°C/85%RH. At 21 mW.
1
1*77
0
8
Operational Life
MIL-STD-202 Method 108
1000 hrs. T=150°C at 1mW.
1
1*77
0
9
External Visual
MIL-STD-883 Method 2009
Inspect device construction, marking and workmanship. Electrical Test not required.
1
All qualification parts submitted
0
10
Physical Dimension
JESD22 Method JB-100
Verify physical dimensions to the applicable device detail specification.
1
1*30
0
12
Resistance to Solvents
MIL-STD-202 Method 215
Note: Add Aqueous wash chemical – OKEM Clean or equivalent. Do not use banned solvents.
1
1*5
0
13
Mechanical Shock
MIL-STD-202 Method 213
Figure 1 of Method 213 Condition F
1
1*30
0
Environmental Test Summary
Test#
Description
Reference
Test Conditions
Lots Tested
Qty Tested
Number Failed
14
Vibration
MIL-STD-202 Method 204
Acceleration：5 g’s
1
1*30
0
15
Resistance to Soldering Heat
MIL-STD-202 Method 210
Condition B No pre-heat of samples.
1
1*30
0
17
ESD
AEC-Q200-002
Discharge capacitance：150 pF
1
1*15
0
18
Solderability
J-STD-002
a)4 h @ 155°C dry heat
1
1*15
0
19
Electrical Characterization
User Spec.
R(-50°C)、R(25°C)、R(150°C)
1
1*30
0
21
Board Flex
AEC-Q200-005
Bend the board： 2mm (Min.)
1
1*30
0
22
TerminalStrength(SMD)
AEC-Q200-006
Apply force：1.0kg (10 N)
1
1*30
0
Parametric Verification Summary
Test #
Description
LSL
USL
Min
Max
Mean
Std. Dev.
Cp,k
3
High Temperature Exposure(Storage)
-5.00%
5.00%
0.25%
0.54%
0.39%
0.08%
18.51
4
Temperature Cycling
-5.00%
5.00%
0.24%
0.46%
0.35%
0.07%
22.68
7
Biased Humidity
-5.00%
5.00%
0.12%
0.62%
0.38%
0.14%
11.28
8
Operational Life
-5.00%
5.00%
0.29%
0.57%
0.42%
0.06%
23.98
10
Physical Dimension L1 (mm)
1.450
1.750
1.644
1.667
1.655
0.007
4.318
10
Physical Dimension W (mm)
0.650
0.950
0.931
0.925
0.919
0.004
2.641
10
Physical Dimension H (mm)
0.650
0.950
0.879
0.915
0.899
0.010
1.747
13
Mechanical Shock
-5.00%
5.00%
0.01%
0.05%
0.04%
0.01%
152.13
14
Vibration
-5.00%
5.00%
0.00%
0.09%
0.04%
0.02%
69.16
15
Resistance to Soldering Heat
-3.00%
3.00%
-0.55%
-0.06%
-0.32%
0.16%
5.70
17
ESD
-5.00%
5.00%
-0.41%
-0.10%
-0.09%
0.17%
9.54
19
Electrical Characterization-R25°C (KΩ)
9.900
10.100
9.926
10.075
9.977
0.039
0.652
19
Electrical Characterization-B Value
3911
3990
3932
3950
3942
5.96
1.75
21
Board Flex
-5.00%
5.00%
0.03%
0.48%
0.27%
0.13%
11.97
22
Terminal Strength(SMD)
-5.00%
5.00%
0.00%
0.09%
0.05%
0.03%
56.09
