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NTC Sensor Module VTB0104F0900LY0011

NTC Sensor Module VTB0104F0900LY0011

The NTC Sensor Module is primarily used in industrial and medical equipment

Product Name NTC Sensor Module
Product series VTB0-104F
Product model VTB0104F0900LY0011

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Product Drawing

Electrical Characteristic

Item Symbol Test Conditions Min. Nor. Max. Unit
Resistance At 25℃ R25 Ta=25℃±0.05℃ PT≦0.1mW 99.000 100.000 101.000
Resistance At 50℃ R50 Ta=50℃±0.05℃ PT≦0.1mW / 35.882 /
B Value B25/50 (3853.887* LnK) 3910.5 3950 3989.5 K
Dissipative coefficient δ Ta=25℃(in air) / 5.0 / ‘mW/℃
Response Time-In liquid τ 25℃→85℃ T1=25+(85-25)*63.2%=62.92℃ / / 3 Sec
Hi-Pot Test / AC1500V 3Sec / / 1.0 m A
Insulation test / DC500V 3Sec / / 100

Maximum use grade

Item Specification Unit
Operation Temperature Range -40 ~ +80
NTC Working Temp.Range -40 ~ +200

Mechanical Tests

Item Pass Criteria Test Conditions
Pull test Not loose, not deformed Fasten body with a Load Applied to each lead 1.0 kg for 1min
Drop Test No visible damage After 5 time natural fall to a maple board from 1M high

Install and use

1.Use this product within the specified temperature range.

2.Higher temperature may cause deterioration of the characteristics or the material quality of this product.

3.Do not melt the solder in resin head, when you solder this product. If you melt the solder in resin head,it has possibility that the break of wire, short and insulation damage.

4.Do not touch the resin head directly by solder iron. It may cause the melt of solder in resin head.

5.At least away from resin head 10mm above when lead dividing.

6.In case you cut the lead wire of this product less than 10mm from resin head,the heat of melted solder at lead wire edge is propagated easily to the resin head along the lead wire.

7.Radius of lead bending should be more than 1mm when lead bending.Holding element by side lead wire is recommended when lead wire is bent or cut.

8.Do not apply an excessive force to the lead. Otherwise, it may cause junction between lead and element to break or crack.

9.The ceramic element of this product is fragile, and care must be taken not to load an excessive press-force or not to give a shock at handling. Such forces may cause cracking or chipping.

10.If you mold by resin this product, please evaluate the quality of this product before you use it.

Storage Conditions

Ambicnt Temperature: -10℃~+40℃

Relative Humidity: ≦75%RH

Keep away from corrosive atmosphere and sunlight

Period of Storage: 1 year

Matters needing attentio

1.Corrosive gas or deoxidizing gas (Chlorine gas, Hydrogen sulfide gas, Ammonia gas, Sulfuric acid gas, Nitric oxide gas, etc.)

2.Volatile or flammable gas

3.Dusty conditions

4.Under vacuum, or under high or low pressure

5.Places with salt water, oils, chemical liquids or organic solvents and do not use directly with quick-drying glue.

6.Strong vibrations

7.Other places where similar hazardous conditions exist

8.Be sure to provide an appropriate fail-safe function on your product to prevent secondary damages that may be caused by the abnormal function or the failure of our product.

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